Drexel University is part of a new $10 million project led by Princeton University to apply artificial intelligence to the design of microchips used in wireless communication systems. Funded through the National Semiconductor Technology Center, the effort is one of several nationwide initiatives created under the CHIPS and Science Act to rebuild U.S. strength in semiconductor innovation.
The 30-month project brings together academic and industry partners, including the University of Southern California, Northeastern, Cadence, Raytheon, Keysight, and GlobalFoundries. The goal is to streamline the design of analog and radio-frequency integrated circuits, essential components in everything from satellites to smartphones.
Ioannis Savidis, PhD, associate professor of electrical and computer engineering, is leading Drexel’s involvement. His team is developing machine learning models that predict circuit performance characteristics, such as gain or bandwidth, based on design structure, reducing the need for time-consuming simulations.
“We’re building models that infer how a design will perform from its parameters,” Savidis said. “It’s a key step toward scalable AI tools that can assist in chip development.”
Drexel’s share of the project totals just over $1 million. In addition to this project, Drexel is part of the Air Force Research Laboratory Mid-Atlantic Hub Network, which supports regional efforts to prototype and commercialize new microelectronics technologies.
“These national networks position us to contribute across the entire semiconductor pipeline,” Savidis said.
Together, these partnerships reflect Drexel Engineering’s growing role in advancing AI-driven chip design and reestablishing U.S. leadership in microelectronics.
